Encapsulant

Introduction

• Also known as overmold

• Present in plastic or TAB packages

• Overmold is almost always an epoxy based compound with a low conductivity (0.6 - 0.7 W/(m.K))

General Thermal Considerations

The low conductivity of the encapsulant makes it a good insulator, and thus offers a large thermal resistance.

Figure 4-15. Encapsulant

Modeling Options

FloTHERM PACK models the encapsulant as a cuboid with a user input conductivity.

Material Properties

Common Epoxy based encapsulant (Mitsubishi): 0.68 W/(m.K)

Validation & References

1. H. Rosten, J. Parry & S. Addison/R. Viswanath/M. Davis & E. Fitzgerald, Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack, Proceedings of the ECTC Conference, May 1995, Las Vegas, U.S.A.